Laser speckle interferometry was used as the experimental method to test the coefficient of thermal expansion ( cte ) of the metal composite leads used in the packaging structures and the thermal deformations of the entire packaging structures due to the change of temperature from room - temperature to 150oc 通过实验和数值模拟的方法对其热变形和热应力进行了研究。采用激光散斑干涉法测量了从室温到150oc的封装用金属复合引线的热膨胀系数和整个封装结构的热变形。
